The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method …

Dec 12, 2023 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …

Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …

DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。

Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had …

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as …

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DAG811 Surface Grinder Automatic Φ200 mm 1 axis, 1 chuck table

“Advanced Kiru, Kezuru and Migaku technologies” is DISCO’s business domain. In other words, DISCO will never deviate from the three technology fields of Kiru (cutting), Kezuru (grinding), …