A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at ...

Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

The report "Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

It vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. However, the enhanced reliability ...

Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking ...

Additionally, the EchoScan ™ system is introduced for detecting voids as small as 1µm in wafer bonding applications, such as advanced hybrid bonding for Cu-Cu interconnects. Initial orders for ...